White paper
Advanced iBGA Image Sensor Encapsulation
Achieve precision, stability, and reliability in automotive vision systems
Modern vehicles rely on sophisticated camera systems to ensure safety and enable autonomous functionality. Each image sensor deployed in these applications faces extreme environmental conditions that traditional semiconductor packaging approaches struggle to address. The combination of miniaturization trends, harsh automotive environments, and stringent reliability requirements has created a need for specialized encapsulation solutions.
Achieve reliable performance throughout your manufacturing process with DELO's PFAS-free encapsulation solution. With optimized flow properties for fine-pitch applications, exceptional warpage reduction, and automotive-grade reliability, it enables cost-effective manufacturing while ensuring lasting stability—even under the most demanding operating conditions.
What can you expect in this white paper?
- Detailed insights into trimodal filler technology for fine-pitch iBGA image sensors
- Test results proving 80% warpage reduction and void-free encapsulation across 66-die arrays
- Comparison of heat-cured vs. dual-cured (low temperature/UV) encapsulation materials
- Solutions for reliable wire bond protection in automotive temperature cycling from -55°C to +125°C
Why encapsulation solutions from DELO?
- Years of expertise in automotive semiconductor packaging meeting AEC-Q100 Grade 2 standards
- Proven long-term reliability, validated through 1,000 temperature cycles with zero wire breakage
- Engineered for automation with dam & fill processes supporting high-volume strip manufacturing
Your advantages at a glance
- Outstanding stability: CTE below 20 ppm/K maintains wire bond integrity over automotive lifetime
- Efficient processes: Low-temperature curing below 120°C reduces cycle times and substrate stress
- High performance: Trimodal filler system ensures void-free flow around 50 μm wire pitches
- Design flexibility: PFAS-free formulation meets European environmental regulations
Let us inspire you!
Discover how DELO's advanced iBGA encapsulation technology sets new standards in automotive reliability, enabling defect-free camera module production for ADAS and autonomous driving applications.
Download the white paper now and learn more!
About DELO
DELO is a leading provider of high-tech adhesives and has been offering solutions for the semiconductor, automotive, and electronics industries for over 25 years. Our innovative technologies set industry standards. Companies such as Bosch, Huawei, and Siemens trust DELO when it comes to superior adhesive technologies.
Industry Leaders Trust DELO
