The two-component epoxy resins are used in the wafer sawing process. Fast initial strength and good debonding behavior are essential.

The new DELO-DUALBOND adhesive is ideal for the active alignment process, and is also suitable for temperature-sensitive materials.

The DELO-FLEXCAP foil cartridge makes it possible for the first time to dispense, transport, store and process DELO adhesives without bubbles being formed. Additionally, the cartridge makes for perfect reproducibility of adhesive dispensing.