Application areas

Smart card / RFID

Smart card

DELO supplies a comprehensive product range for the smart card industry. These products match all applications and fulfill all requirements common in this field.

This is why DELO is the world market leader in terms of technology, quality, and quantity.

Our product range includes UV-curing chip encapsulants, heat-curing materials used as Dam&Fill or Glob Top, and ideally adapted die attach adhesives.

In line with the specific requirement profile, the products fulfill all needs in versions from tension-equalizing to hard. In addition, they lend to very high strength comparable to molding and are opaque to fulfill the utmost safety requirements. These products are used in all fields of chip card technology, from simple phone cards to banking cards used under extreme conditions.

Segments

Opaque chip encapsulation with Dam&Fill® adhesives

UV-curing chip encapsulants are state-of-the-art in the chip card industry. A precondition for light curing is that the encapsulants transmit light. Increased safety requirements by which the chip is protected from unauthorized viewing and copying, results in the need for black encapsulants with high mechanical loading capacity. This is where UV-curing products reach their limits.

Therefore, DELO has developed new Dam&Fill® encapsulants as an innovative solution. The heat-curing adhesives are optically intransparent, provide a very high degree of mechanical protection, and are easy to process on existing encapsulation systems. DELO's Dam&Fill® compounds are absolutely opaque even in thin layers.

Advantages overview of black Dam&Fill® compounds:

Enables short cycle times
High mechanical stress values compared to conventional UV-curing encapsulants
Easy to integrate into existing encapsulation systems

more...

RFID

We are the world market leader in adhesives for the RFID market. At this point, one in three RFID labels contains DELO’s adhesive. Requirements are ever-changing as new, temperature-sensitive materials such PVC are flooding the market and chips are getting increasingly small and efficient. Reliable joining and contacting of chip and antenna are essential to ensure that the RFID tag works properly. DELO’s adhesives are used and are precisely adjusted to the customer’s specific process parameters. We support our customers over the entire process, from the analysis of the requirement profile and comprehensive lab testing to dispensing, placing, curing and testing, to the ramp-up and implementation into series production. We also work together with many substrate and antenna manufacturers and disparate plant constructors in all RFID markets.

Interested in further details? Visit www.rfid-adhesives.com

Segments

Flip-chip

In the RFID flip-chip process, the adhesive has the task to reliably fix the microchip to the RFID antenna at a defined position. For this purpose, DELO supplies non-conductive die attach adhesives or anisotropic conductive adhesives. We are the market leader in adhesives for the flip-chip process in RFID applications.

The adhesive does not only take mechanical tasks, but also establishes the electrical contact. The product range was specifically developed for reliable contacting with short curing time in the production process.

Properties