DE  |  EN
DELO Homepage
Photovoltaics

Photovoltaics

Regenerative energies, such as photovoltaics, are gaining ground. Longevity, high efficiency, and reduced costs are decisive for both crystalline and thin-film solar modules. Thin-film technologies in particular promise cost advantages. This is thanks to clearly reduced consumption of material and energy in module production. Thin-film modules have meanwhile established themselves on the market and are produced at acceptable efficiency rates.

More and more conductive adhesives made by DELO are being used in the production of the thin-film cells. They are replacing soldering as a joining method. On top of that, adhesives are used to produce conventional silicon solar cells. During the wafering process, the silicon ingots are bonded with DELO adhesives. Afterwards, they are cut into wafers. Debonding from the carrier plate then proceeds without leaving any residues.

Segments

Adhesives for wafer cutting

The increasing cost pressure on the photovoltaics market means that production processes must be optimized continuously. DELO’s two-component RM compounds (ReMovables) are precisely tailored to the high requirements in the wafering process, and therefore make possible high output rates. To prepare the cutting process, the assembly plate, the loss plate or carrier, and the silicon ingots are bonded and fixed.

Wafer cutting - process

During wafering, the bonded silicon ingots are clamped into the wire saw by means of the assembly plate. Then they are cut into thin wafers. The adhesive must reliably fix the cut wafers to the loss plate. Afterwards, the wafers must be debonded from the loss plate without leaving any residue, for example, in baths of hot water or diluted acid. The adhesive must not contaminate the debonding bath or the silicon, but should adhere to the carrier.

 

DELO-DUOPOX RM

Properties

  • Nonylphenol-free
  • High temperature stability and high bond strength on silicon, glass, polymer, steel, or aluminum
  • Excellent resistance to glycol (slurry)
  • Universal debonding in annealed media like water or diluted acids without leaving any residue

 

Advantages

  • Excellent sawing properties for slurry and diamond wire saws
  • Reliable fixing during cutting and very low silicon waste
  • Easy processing
  • High process reliability
  • Processing times and curing times tailored to the process
  • No contamination of the silicon material during debonding
more...
Contacting of thin-film cells

Contacting of thin-film cells by conductive adhesives is a gentle conducting method and has numerous advantages over conventional methods like soldering and ultrasonic welding. The maximum curing temperature of the adhesives is +150 °C, which is significantly lower than the temperature during soldering.

Conductive adhesives

The adhesives’ tension-equalizing properties prevent mechanical tensions and reduce micro cracks and cell failure. DELO supplies customized products for various variants of thin-film modules.

 

Properties

  • One-component and heat-curing
  • 100 % solvent-free
  • Easy handling and dispensing
  • Fast curing
  • Long processing time
  • Reliable and permanent contacting
  • Optimized for a wide variety of thin-film surfaces and structures (rigid, flexible)

 

Advantages

  • Easy to integrate into existing production processes
  • Reduction of the cycle time by single shot process option (lamination and adhesive curing in one step)
  • High process reliability
  • Optimized output
  • Flexible material selection

more...
Contact

DELO Industrial Adhesives
DELO-Allee 1
86949 Windach, Germany

+49 8193 9900 - 0

+49 8193 9900 - 144

Brochures