Application areas

Optoelectronics

Optoelectronics are considered the technology of the future. The trend towards miniaturization drives cost savings in many applications. In addition, the transfer of data rates can be done optically, instead of electronically. The strong growth of innovative technologies, such as wafer level cameras and LEDs, and the challenges involved also boost the requirements made on materials and adhesives. Transparent and thermally stable adhesives are in strong demand, especially in soldering processes. DELO supplies a range of products for UV replica processes and demanding bonding task for many applications in optoelectronics.

Properties

High transmission of visible light
Low outgassing
Low shrinkage
High loading capacity and thermal UV stability, especially in reflow processes
High curing speed

Segments

Wafer level cameras

PDAs, laptops, and cell phones are experiencing a boom. The industry puts great efforts into the development of cell phone cameras to reduce their size, increase production volumes, and cut down costs. Innovative wafer level cameras meet this need. Together with our customers, DELO has especially developed fast-curing and highly transparent imprint materials.

Such optical materials with a high yellowing stability mold the lens. In addition, special adhesives are available to bond single lenses. This method provides essential benefits to the customers. These include the miniaturization of the camera modules, extremely high reliability, and the utmost quality.

Applications

UV replica processes and micro lens imprint
Lens mastering
Wafer stacking

Properties

High yellowing stability at elevated temperatures, especially in reflow processes
Very high transmission of visible light
Low outgassing
Very low shrinkage
Excellent adhesion to glass and simultaneous possibility of debonding from plunger
Adjusted fillers to control the adhesive layer thickness in wafer stacking
Halogen-free (IEC 61249-2-21)
Dual-curing adhesives are available

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LED packages

LED packages make special requirements on the stability of the adhesives used. New transparent sapphire chips and lens bonding require highly transparent and thermally stable adhesives.

Applications